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| Thermal Data POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.6 W/cmC 0.01 W/cmC leadframe die attach copper epoxy glue (silver filled) 0.25 mm 15-50 m molding compound epoxy resin 3 mm 0.0063W/cmC Charts enclosed : 1) Rth(j-a) vs on board heat sink 2) Zth(j-a) vs time width November 2000 1/2 Thermal Data Rth(j-c) (C/W) 60 POWER DIP 20+2+2 Test board with two " on board " square heat sink versus side l 55 1) 50 45 die pad = 152x160 sq.mils die size = 120x130 sq.mils Pd = 2 Watt l on board copper area thickness : 35 m 40 70 m 35 105 m 30 25 0 1 2 3 side l ( cm ) on PCB heat sink 4 5 Transient Thermal Resistance (C/W) 50 SINGLE PULSE C Pd = 2 Watt, mounted on board die size = 120x130 sq.mils dissipating area = 2.000 sq.mils A B 2) 10 A = 35 m thick, no heat sink B = 35 m thick 4x4 sq.cm on board Cu area C = 105 m thick 4x4 sq.cm on board Cu area 1 0.001 0.01 0.1 1 10 Time or pulse width ( s ) 100 1,000 2/2 |
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